Sigma W12 – Wafer bond tester
Sigma W12
Wafer bond tester
Bond tester for wafers 2 – 12 inch
- Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)
- Precise testing and Cold Bump Pull (CBP) testing
- Large X/Y stages X: 600mm, Y: 370 mm
- Force range from 1gf – 10 kgf
- Bump pitch down to 20 µm
Intelligent lift pins
Gently secure flat and warped wafers because of the soft, flexible tips on the PID controlled wafer lift pins. Vacuum sensing and switching are intelligently timed with the lift pin position throughout the load, clamp, and unload cycle.
Wafer pusher
In cases of extreme warpage, an optional wafer pusher ensures precise clamping. The high airflow of vacuum chucks pulls down wafers.
Wafer cleaning unit
Keep test debris away from the wafer or the wafer chuck with a blower and vacuum cleaner or a roller with sticky foil, for pre- and post-cleaning.
Wafer/panel handler (EFEM)
Integration transforms the bond tester into a fully automated system. We offer various types of wafer handlers (Equipment Front End Module), for operator-free bond testing.
Panel chuck work holder
Vacuum work holder for panels or wafers up to 300 mm. Easily reach 100% of a 300 mm panel without repositioning your sample on the chuck. The wafer chuck work holder comes with safety interlocks and 360° rotation.
Substrate wafer map import
Easily import and export multiple file formats for wafer maps such as KLARF, (S)INF, G85, and others for full traceability. Defects or test positions are shown in an overview and are directly accessible for testing or analysis.
Big bump removal
Automatically shear the big bumps and clean the debris to prepare for wafer probing. Fully programmable vision algorithms can check if the removal of big bumps was successful.
CBP Jaw Cleaner
The solder that builds up in the cavity of the Cold Bump Pull (CBP) jaw reduces the gripping efficiency. This contactless cavity cleaner melts the solder with a high temperature and high-pressure air jet and then blows it into a fine matrix where it is absorbed.
Full automation
Eliminate human error and save production costs.
Loading
Handlers
Robotic handling ensures safe load and unload of applications and avoids handling error and damage. We offer handlers for:
- Wafers (EFEM)
- Waffle trays
- Magazines
Testing
Easy programming
The open Sigma software enables easy programming of total automation steps, positions, and commands. The automation editor employs camera visualization and intelligent wizards.
Smart vision cameras
See the unseen with up to 3 live camera options. Bring out the features of interest with images or videos using high-resolution cameras, flexible LED illumination, and fantastic image processing options.
Tool alignment
Precise tool alignment is essential to test the correct bonds correctly. We offer several solutions for perfect alignment:
- Self-aligning shear tool
- Deep access
- Revolving Measurement Unit
- Concentricity correction
Fiducial recognition
Define recognizable shapes, patterns, or marks as a global or local reference for positioning and automatic tool alignment.
Wire dection
Recognition of components and fine pitch wires that are swept out of position due to process tolerances or part handling.
Analyzing
Grading run
A Sigma offers 2 alternatives to make grading more efficient and consistent:
- The operator does all the gradings in one step after a sequence of tests, using the microscope or an offset camera.
- A Sigma can take it one step further and make automatic determinations of the failure modes (auto grading).
Auto grading
Automatically grade the failure modes of the test result images with grading assistance. Optical inspection calculates the area of bulk material remaining as a percentage of the whole.
Image measurement (AOI)
Detailed optical inspection helps you to perform image measurements or to identify the failure modes of the captured test results. For more advanced image processing, filtering, segmentation, and detection of shapes, you can use Automated Optical Inspection (AOI).
Data export
Improve data processing using automatic export and SECS/GEM for tracking and control.
A pleasure to
set up
- Easy sample access
- Flexible LED lighting options
- Designed with the operators in mind
- Adjustable microscope
- No stress working conditions
Easy to use
for everyone
- Flexible on-board Statistical Process Control (SPC) analysis
- Unique form features for SPC management
- Software has Easy and Expert modes
- Control chart and real-time force graphs
- Flexible export and SECS/GEM
Modular by
design
- Customized tools and work holders
- Operator free loading options
- Powerful camera options
Specifications Sigma W12
| STAGES | SIGMA |
|---|---|
| X-stage (mm) | 500 |
| Y-stage (mm) | 370 |
| Z-stage (mm) | 90 |
| Axis speed (mm/s) | 50 |
| Resolution linear encoders (backlash free drives) (nm) | 30 |
| Digital temperature correction |  |
| ACCURACY | |
| Accuracy (%) | 0.075 |
| ADC resolution (bit) | 24 |
| Sampling frequency (kHz) | 10 |
| Shear height (step back) accuracy ±1 μm | |
| Programmable landing force down to 5 gf | |
| MECHANICAL | |
| Footprint X (mm) | 1300 |
| Footprint Y (mm) | 935 |
| Height (mm) | 608 |
| Weight (± kg) | 100 |
Please contact us for more information and options for your factory. Specifications are subject to change without prior notice.
Standard
Optional
Not available